Semiconductor Wafer Dryer from Japan
High-precision dryer using heated nitrogen or IPA vapor for drying processed semiconductor wafers post-rinse, preventing watermarks via temperature control. Directly under HTS 8419.39.0280 as other industrial dryers for material treatment. Essential in cleanroom wafer fab lines.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Certify cleanroom compatibility and gas heating specs for duty assessment
• Declare exact drying method (e.g
• Marangoni) to avoid generic dryer misclassification