Wafer Annealing Furnace Muffle from Japan
High-temperature resistant muffle (inner chamber) for rapid thermal annealing furnaces used in semiconductor wafer processing to activate dopants and repair crystal damage. Falls under HTS 8417.90.00.00 as parts of nonelectric industrial ovens for semiconductor device fabrication. Constructed from materials tolerating 1200°C+ processing temperatures.
Duty Rate — Japan → United States
13.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide thermal processing specifications and semiconductor end-use documentation; ensure muffle dimensions match standard 200mm/300mm wafer sizes; avoid classification as generic kiln parts