Wafer Annealing Furnace Muffle from Japan
High-temperature resistant muffle (inner chamber) for rapid thermal annealing furnaces used in semiconductor wafer processing to activate dopants and repair crystal damage. Falls under HTS 8417.90.00.00 as parts of nonelectric industrial ovens for semiconductor device fabrication. Constructed from materials tolerating 1200°C+ processing temperatures.
Duty Rate — Japan → United States
18.9%
Rate breakdown
9903.82.1015%Except as provided for in headings 9903.82.12, 9903.82.17 and 9903.85.68, derivative aluminum and steel articles with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent, as provided for in subdivision (f) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Provide thermal processing specifications and semiconductor end-use documentation; ensure muffle dimensions match standard 200mm/300mm wafer sizes; avoid classification as generic kiln parts