Wafer Oxidation Furnace from Germany
Nonelectric horizontal furnace growing thermal oxide layers on semiconductor wafers via steam or dry oxygen ambient at 900-1200°C. Fundamental for MOS gate dielectrics and isolation structures. Classified under 8417.80.00.00 as industrial processing furnace.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify oxide thickness uniformity specs and LPCVD compatibility; document boat loading systems
• Common issue: classifying source gas cabinets separately as parts excluded from subheading