Wafer Annealing Furnace from Japan
Industrial nonelectric furnace for high-temperature annealing of semiconductor wafers to relieve stresses and activate dopants after ion implantation. Uses rapid thermal processing in controlled atmospheres without electric resistance heating. Classified in 8417.80.00.00 for its role in semiconductor device fabrication processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide process recipes showing semiconductor wafer compatibility and nonelectric heating method
• Include cleanroom certification if applicable for duty preference claims
• Common pitfall: incorrect classification as diffusion furnaces under 8486 if multifunctional