Hydrogen Bake Furnace from Japan
Nonelectric furnace for high-temperature hydrogen baking of semiconductor wafers to remove native oxides and hydrogen-passivate surface defects before epitaxial growth. Uses forming gas mixtures in controlled environment. Classified 8417.80.00.00 as industrial furnace for wafer preparation processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document hydrogen safety interlocks and wafer carrier specifications; reference epi-ready wafer production
• Pitfall: bulk import without end-use statements triggers general machinery classification