Hydrogen Bake Furnace from China
Nonelectric furnace for high-temperature hydrogen baking of semiconductor wafers to remove native oxides and hydrogen-passivate surface defects before epitaxial growth. Uses forming gas mixtures in controlled environment. Classified 8417.80.00.00 as industrial furnace for wafer preparation processing.
Duty Rate — China → United States
41.4%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Document hydrogen safety interlocks and wafer carrier specifications; reference epi-ready wafer production
• Pitfall: bulk import without end-use statements triggers general machinery classification