Wafer Lapping Machine Vacuum Hold-Down Pump from Japan
Vacuum pump component for wafer lappers that flatten semiconductor wafers to precise tolerances during preparation, statistical note (a)(ii)(C). Provides hold-down vacuum to secure wafers during double-sided lapping operations. HTS 8414.90.91 for parts of such semiconductor wafer processing vacuum systems.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide lapping machine technical data proving wafer dimensional tolerance function per statistical notes
• Document slurry management system integration, critical for semiconductor wafer prep classification