Wafer Lapping Machine Vacuum Hold-Down Pump from Japan
Vacuum pump component for wafer lappers that flatten semiconductor wafers to precise tolerances during preparation, statistical note (a)(ii)(C). Provides hold-down vacuum to secure wafers during double-sided lapping operations. HTS 8414.90.91 for parts of such semiconductor wafer processing vacuum systems.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide lapping machine technical data proving wafer dimensional tolerance function per statistical notes
• Document slurry management system integration, critical for semiconductor wafer prep classification