Semiconductor Wafer Slicing Saw Vacuum Pump from Japan
Vacuum pump part for wafer slicing saws that cut monocrystalline boules into semiconductor wafers, as described in statistical note (a)(ii)(B). It provides coolant mist evacuation and chip removal under vacuum during precision diamond saw operations. HTS 8414.90.91 covers such specialized pump parts for semiconductor wafer preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit wafer slicing saw OEM specifications confirming statistical note (a)(ii)(B) classification criteria
• Document diamond blade coolant system integration, as vacuum function is essential for debris management