Semiconductor Wafer Slicing Saw Vacuum Pump from Japan
Vacuum pump part for wafer slicing saws that cut monocrystalline boules into semiconductor wafers, as described in statistical note (a)(ii)(B). It provides coolant mist evacuation and chip removal under vacuum during precision diamond saw operations. HTS 8414.90.91 covers such specialized pump parts for semiconductor wafer preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Submit wafer slicing saw OEM specifications confirming statistical note (a)(ii)(B) classification criteria
• Document diamond blade coolant system integration, as vacuum function is essential for debris management