Semiconductor Wafer Polisher Vacuum Pump from Germany
Specialized pump for wafer polishers that achieve mirror-finish flatness on semiconductor wafers prior to fabrication, statistical note (a)(ii)(C). Manages chemical mechanical polishing (CMP) slurry evacuation and backside vacuum chucking. Parts thereof under HTS 8414.90.91 for semiconductor wafer prep equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include CMP polisher specifications showing surface flatness <1 microinch RMS achievement
• Reference statistical note (a)(ii)(C) explicitly in import documentation for polishers