Semiconductor Wafer Polisher Vacuum Pump from China
Specialized pump for wafer polishers that achieve mirror-finish flatness on semiconductor wafers prior to fabrication, statistical note (a)(ii)(C). Manages chemical mechanical polishing (CMP) slurry evacuation and backside vacuum chucking. Parts thereof under HTS 8414.90.91 for semiconductor wafer prep equipment.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Include CMP polisher specifications showing surface flatness <1 microinch RMS achievement
• Reference statistical note (a)(ii)(C) explicitly in import documentation for polishers