Semiconductor Wafer Polisher Vacuum Pump from Canada
Specialized pump for wafer polishers that achieve mirror-finish flatness on semiconductor wafers prior to fabrication, statistical note (a)(ii)(C). Manages chemical mechanical polishing (CMP) slurry evacuation and backside vacuum chucking. Parts thereof under HTS 8414.90.91 for semiconductor wafer prep equipment.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include CMP polisher specifications showing surface flatness <1 microinch RMS achievement
• Reference statistical note (a)(ii)(C) explicitly in import documentation for polishers