Plasma Etch Vacuum Pump for Wafer Processing from Mexico
High-vacuum pump part for plasma etching equipment in semiconductor wafer fabrication, supporting the processing of semiconductor materials into devices. Essential for maintaining process vacuum during reactive ion etching of wafer patterns. HTS 8414.90.91 covers such parts used in semiconductor device processing.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Provide plasma etch chamber specifications showing semiconductor device processing function
• Document compatibility with fluorinated etch gases (SF6, CF4) required for classification
• Avoid general vacuum pump classification by including etch rate and wafer size specifications