Gallium Arsenide Wafer Prep Vacuum Pump from China

Specialized vacuum pump for preparation equipment handling gallium arsenide semiconductor wafers, explicitly mentioned in statistical notes. Used in grinding, slicing, and polishing of GaAs boules for compound semiconductor devices. Classified under HTS 8414.90.91 as parts for semiconductor wafer manufacturing equipment.

Duty Rate — China → United States

35%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]

Import Tips

Explicitly reference gallium arsenide compatibility in technical specifications per statistical notes

Document differences from silicon processing (brittle material handling) for classification