Wafer Slicing Saw Vacuum Extraction Pump from Japan
Vacuum pump part for wafer slicing saws that remove slurry and debris during diamond saw cutting of semiconductor boules into wafers. Falls under HTS 8414.90.91.80 as part of wafer preparation equipment noted in statistical definitions. Ensures clean slicing environment for precise wafer thickness control.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include saw equipment OEM documentation linking pump to wafer slicing function
• Cleanroom-compatible materials certification required
• Avoid pitfall of classifying as general shop vac under 8414.80