Wafer Slicing Saw Vacuum Extraction Pump from Germany
Vacuum pump part for wafer slicing saws that remove slurry and debris during diamond saw cutting of semiconductor boules into wafers. Falls under HTS 8414.90.91.80 as part of wafer preparation equipment noted in statistical definitions. Ensures clean slicing environment for precise wafer thickness control.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include saw equipment OEM documentation linking pump to wafer slicing function
• Cleanroom-compatible materials certification required
• Avoid pitfall of classifying as general shop vac under 8414.80