Wafer Slicing Saw Vacuum Extraction Pump from China
Vacuum pump part for wafer slicing saws that remove slurry and debris during diamond saw cutting of semiconductor boules into wafers. Falls under HTS 8414.90.91.80 as part of wafer preparation equipment noted in statistical definitions. Ensures clean slicing environment for precise wafer thickness control.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include saw equipment OEM documentation linking pump to wafer slicing function
• Cleanroom-compatible materials certification required
• Avoid pitfall of classifying as general shop vac under 8414.80