Wafer Slicing Saw Vacuum Extraction Pump from Canada
Vacuum pump part for wafer slicing saws that remove slurry and debris during diamond saw cutting of semiconductor boules into wafers. Falls under HTS 8414.90.91.80 as part of wafer preparation equipment noted in statistical definitions. Ensures clean slicing environment for precise wafer thickness control.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Include saw equipment OEM documentation linking pump to wafer slicing function
• Cleanroom-compatible materials certification required
• Avoid pitfall of classifying as general shop vac under 8414.80