Wafer Lapping Machine Vacuum Chucking Pump from Japan
High-precision vacuum pump part for wafer lappers that hold wafers during flatness correction in semiconductor preparation. Covered by HTS 8414.90.91.80 statistical note for wafer grinders, lappers and polishers. Critical for achieving surface flatness tolerances before fab processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Flatness specification sheets linking to lapping tolerance requirements
• Cleanroom class 100 certification mandatory
• Common error: reclass to general lab pumps without semi proof