Wafer Lapping Machine Vacuum Chucking Pump from Japan
High-precision vacuum pump part for wafer lappers that hold wafers during flatness correction in semiconductor preparation. Covered by HTS 8414.90.91.80 statistical note for wafer grinders, lappers and polishers. Critical for achieving surface flatness tolerances before fab processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Flatness specification sheets linking to lapping tolerance requirements
• Cleanroom class 100 certification mandatory
• Common error: reclass to general lab pumps without semi proof