Wafer Lapping Machine Vacuum Chucking Pump from China
High-precision vacuum pump part for wafer lappers that hold wafers during flatness correction in semiconductor preparation. Covered by HTS 8414.90.91.80 statistical note for wafer grinders, lappers and polishers. Critical for achieving surface flatness tolerances before fab processing.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Flatness specification sheets linking to lapping tolerance requirements
• Cleanroom class 100 certification mandatory
• Common error: reclass to general lab pumps without semi proof