Gallium Arsenide Wafer Prep Vacuum Pump from Japan
Specialized vacuum pump for GaAs compound semiconductor wafer grinding/lapping equipment noted in statistical definitions. HTS 8414.90.91.80 covers processing of gallium arsenide materials into wafers. Handles corrosive etching byproducts unique to III-V semiconductors.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• GaAs-specific corrosion resistance test data mandatory
• Link to statistical note via compound semi material handling specs
• Avoid reclassification as generic corrosive vac