Gallium Arsenide Wafer Prep Vacuum Pump from Japan
Specialized vacuum pump for GaAs compound semiconductor wafer grinding/lapping equipment noted in statistical definitions. HTS 8414.90.91.80 covers processing of gallium arsenide materials into wafers. Handles corrosive etching byproducts unique to III-V semiconductors.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• GaAs-specific corrosion resistance test data mandatory
• Link to statistical note via compound semi material handling specs
• Avoid reclassification as generic corrosive vac