Wafer Slicing Vacuum Saw from Japan
Precision diamond wire saw with integrated vacuum pump system for slicing semiconductor boules into thin wafers while maintaining cleanroom-compatible coolant evacuation. HTS 8414.80.90.00 covers the specialized vacuum pump apparatus essential to the slicing process.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include wafer thickness specifications (<1000μm) to prove semiconductor use
• Document diamond wire tensioning and vacuum coolant systems in technical files
• Comply with cleanroom certification standards (ISO 14644) for classification support