Wafer Slicing Vacuum Saw from Germany
Precision diamond wire saw with integrated vacuum pump system for slicing semiconductor boules into thin wafers while maintaining cleanroom-compatible coolant evacuation. HTS 8414.80.90.00 covers the specialized vacuum pump apparatus essential to the slicing process.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include wafer thickness specifications (<1000μm) to prove semiconductor use
• Document diamond wire tensioning and vacuum coolant systems in technical files
• Comply with cleanroom certification standards (ISO 14644) for classification support