Wafer Slicing Vacuum Saw from China
Precision diamond wire saw with integrated vacuum pump system for slicing semiconductor boules into thin wafers while maintaining cleanroom-compatible coolant evacuation. HTS 8414.80.90.00 covers the specialized vacuum pump apparatus essential to the slicing process.
Duty Rate — China → United States
41.2%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Include wafer thickness specifications (<1000μm) to prove semiconductor use
• Document diamond wire tensioning and vacuum coolant systems in technical files
• Comply with cleanroom certification standards (ISO 14644) for classification support