Wafer Lapping Vacuum Polisher from Mexico
Double-sided lapping machine with vacuum chucks and slurry evacuation pumps for achieving semiconductor wafer flatness tolerances under 1μm. The HTS 8414.80.90.00 classification applies to its specialized vacuum handling systems critical for wafer planarity.
Duty Rate — Mexico → United States
13.7%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Document total thickness variation (TTV) specs (<1μm) in import declaration
• Include slurry recirculation vacuum system schematics
• Verify equipment meets SEMI standards (E.g
• SEMI M1 specifications)