Wafer Lapping Vacuum Polisher from Japan
Double-sided lapping machine with vacuum chucks and slurry evacuation pumps for achieving semiconductor wafer flatness tolerances under 1μm. The HTS 8414.80.90.00 classification applies to its specialized vacuum handling systems critical for wafer planarity.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document total thickness variation (TTV) specs (<1μm) in import declaration
• Include slurry recirculation vacuum system schematics
• Verify equipment meets SEMI standards (E.g
• SEMI M1 specifications)