Wafer Lapping Vacuum Polisher from China
Double-sided lapping machine with vacuum chucks and slurry evacuation pumps for achieving semiconductor wafer flatness tolerances under 1μm. The HTS 8414.80.90.00 classification applies to its specialized vacuum handling systems critical for wafer planarity.
Duty Rate — China → United States
38.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Document total thickness variation (TTV) specs (<1μm) in import declaration
• Include slurry recirculation vacuum system schematics
• Verify equipment meets SEMI standards (E.g
• SEMI M1 specifications)