PECVD Vacuum Foreline Pump from Mexico
Dry roughing pump for PECVD (Plasma Enhanced Chemical Vapor Deposition) systems handling corrosive precursor gases in thin film deposition. HTS 8414.80.90.00 covers semiconductor-specific vacuum pumping with chemical resistance.
Duty Rate — Mexico → United States
13.7%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify chemical compatibility (TEOS, NH3, SiH4) in material certs
• Document dry pump technology vs. wet pump alternatives
• Include particle generation rate data (<0.05 particles/cm³)