PECVD Vacuum Foreline Pump from China
Dry roughing pump for PECVD (Plasma Enhanced Chemical Vapor Deposition) systems handling corrosive precursor gases in thin film deposition. HTS 8414.80.90.00 covers semiconductor-specific vacuum pumping with chemical resistance.
Duty Rate — China → United States
41.2%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Specify chemical compatibility (TEOS, NH3, SiH4) in material certs
• Document dry pump technology vs. wet pump alternatives
• Include particle generation rate data (<0.05 particles/cm³)