PECVD Vacuum Foreline Pump from China
Dry roughing pump for PECVD (Plasma Enhanced Chemical Vapor Deposition) systems handling corrosive precursor gases in thin film deposition. HTS 8414.80.90.00 covers semiconductor-specific vacuum pumping with chemical resistance.
Duty Rate — China → United States
38.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Specify chemical compatibility (TEOS, NH3, SiH4) in material certs
• Document dry pump technology vs. wet pump alternatives
• Include particle generation rate data (<0.05 particles/cm³)