Crystal Boule Grinder Vacuum System from Japan
Vacuum-assisted grinding machine that shapes semiconductor crystal boules to precise diameters and flats indicating resistivity, with dust extraction pumps. Falls under 8414.80.90.00 for the critical vacuum debris management in semiconductor wafer preparation.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify flat grinding tolerances (within 0.1mm) proving semiconductor spec compliance
• Include vacuum flow rate data showing particle control capability
• Prepare for CBP review of boule diameter range (100-450mm typical)