Wafer Slicing Saw Gas Compressor from Japan
400 kW rotary gas compressor supplying coolant and process gases to diamond wire wafer slicing saws that cut silicon boules into thin wafers. Ensures precise pressure control for minimal kerf loss in semiconductor wafer preparation. HTS 8414.80.20.65 applies to its power capacity and wafer manufacturing role.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Label with exact CFM and pressure ratings matching statistical note criteria for wafer equipment
• Avoid common pitfall of classifying as general machine tool compressor; emphasize semiconductor use
• Require material safety data sheets for process gases used