Wafer Lapping Polisher Vacuum Compressor from Japan
550 kW vacuum compressor for wafer grinders, lappers, and polishers that achieve mirror-flat surfaces on semiconductor wafers within tight tolerances. Enables fabrication-ready wafer flatness critical for device processing. HTS 8414.80.20.65 covers this power-rated equipment per statistical notes.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Document flatness specifications achieved (e.g
• <1 micron) to validate wafer prep classification
• Ensure cleanroom compatibility certification (FED-STD-209) for import inspection
• Pair with end-user declarations specifying semiconductor fab destination