Wafer Lapping Polisher Vacuum Compressor from Japan
550 kW vacuum compressor for wafer grinders, lappers, and polishers that achieve mirror-flat surfaces on semiconductor wafers within tight tolerances. Enables fabrication-ready wafer flatness critical for device processing. HTS 8414.80.20.65 covers this power-rated equipment per statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document flatness specifications achieved (e.g
• <1 micron) to validate wafer prep classification
• Ensure cleanroom compatibility certification (FED-STD-209) for import inspection
• Pair with end-user declarations specifying semiconductor fab destination