Wafer Lapping Polisher Vacuum Compressor from Germany
550 kW vacuum compressor for wafer grinders, lappers, and polishers that achieve mirror-flat surfaces on semiconductor wafers within tight tolerances. Enables fabrication-ready wafer flatness critical for device processing. HTS 8414.80.20.65 covers this power-rated equipment per statistical notes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document flatness specifications achieved (e.g
• <1 micron) to validate wafer prep classification
• Ensure cleanroom compatibility certification (FED-STD-209) for import inspection
• Pair with end-user declarations specifying semiconductor fab destination