Wafer Lapping Polisher Vacuum Compressor from China
550 kW vacuum compressor for wafer grinders, lappers, and polishers that achieve mirror-flat surfaces on semiconductor wafers within tight tolerances. Enables fabrication-ready wafer flatness critical for device processing. HTS 8414.80.20.65 covers this power-rated equipment per statistical notes.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Document flatness specifications achieved (e.g
• <1 micron) to validate wafer prep classification
• Ensure cleanroom compatibility certification (FED-STD-209) for import inspection
• Pair with end-user declarations specifying semiconductor fab destination