High-Pressure Wafer Coolant Compressor from Japan
350 kW compressor delivering high-pressure deionized water and slurry to wafer grinders and polishers during semiconductor surface preparation. Maintains consistent flow for uniform material removal. Covered by HTS 8414.80.20.65 statistical provisions.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Certify materials compatibility with DI water and CMP slurries
• Document pressure ratings exceeding standard industrial levels
• Include system diagrams showing integration with lapping/polishing tools