High-Pressure Wafer Coolant Compressor from Japan
350 kW compressor delivering high-pressure deionized water and slurry to wafer grinders and polishers during semiconductor surface preparation. Maintains consistent flow for uniform material removal. Covered by HTS 8414.80.20.65 statistical provisions.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify materials compatibility with DI water and CMP slurries
• Document pressure ratings exceeding standard industrial levels
• Include system diagrams showing integration with lapping/polishing tools