High-Pressure Wafer Coolant Compressor from Japan
350 kW compressor delivering high-pressure deionized water and slurry to wafer grinders and polishers during semiconductor surface preparation. Maintains consistent flow for uniform material removal. Covered by HTS 8414.80.20.65 statistical provisions.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Certify materials compatibility with DI water and CMP slurries
• Document pressure ratings exceeding standard industrial levels
• Include system diagrams showing integration with lapping/polishing tools