Wafer Lapping Vacuum Extraction Pump from Japan
Oil-free vacuum pump for wafer lappers that extracts lapping slurry and maintains flatness tolerances during semiconductor wafer surface preparation. Classified in HTS 8414.10.00.00 per statistical notes for wafer preparation equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include surface flatness tolerance data (e.g
• <1μm) proving semiconductor application
• Ensure cleanroom compatibility certification (ISO Class 1-5) for customs review