Wafer Slicing Saw Coolant Circulation Pump from Mexico
Pump designed for high-pressure coolant delivery in wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers, as noted in statistical note (b)(ii)(B). Ensures clean cuts and prevents thermal damage during diamond saw operations. HTS 8413.81.00 covers these other specialized liquid pumps.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Submit equipment manuals highlighting pump's role in wafer slicing to validate classification
• Certify compatibility with deionized water or specialty coolants used in semiconductor saws
• Beware of classification as general machine tool pumps if end-use not clearly documented