Wafer Slicing Saw Coolant Circulation Pump from Japan
Pump designed for high-pressure coolant delivery in wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers, as noted in statistical note (b)(ii)(B). Ensures clean cuts and prevents thermal damage during diamond saw operations. HTS 8413.81.00 covers these other specialized liquid pumps.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit equipment manuals highlighting pump's role in wafer slicing to validate classification
• Certify compatibility with deionized water or specialty coolants used in semiconductor saws
• Beware of classification as general machine tool pumps if end-use not clearly documented