Wafer Slicing Saw Coolant Circulation Pump from China
Pump designed for high-pressure coolant delivery in wafer slicing saws that cut monocrystalline semiconductor boules into thin wafers, as noted in statistical note (b)(ii)(B). Ensures clean cuts and prevents thermal damage during diamond saw operations. HTS 8413.81.00 covers these other specialized liquid pumps.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Submit equipment manuals highlighting pump's role in wafer slicing to validate classification
• Certify compatibility with deionized water or specialty coolants used in semiconductor saws
• Beware of classification as general machine tool pumps if end-use not clearly documented