Wafer Dicing Coolant Pump from Germany
High-pressure pump for coolant in laser or mechanical wafer dicing saws separating finished semiconductor devices. Prevents chipping and thermal damage. HTS 8413.81.00 other pumps.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify dicing kerf width and coolant pressure specs
• Include die strength post-dice process data