Wafer Dicing Coolant Pump from Canada
High-pressure pump for coolant in laser or mechanical wafer dicing saws separating finished semiconductor devices. Prevents chipping and thermal damage. HTS 8413.81.00 other pumps.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify dicing kerf width and coolant pressure specs
• Include die strength post-dice process data