Silicon Wafer Polishing Slurry Pump from Japan
Specialized pump circulating colloidal silica slurries for chemical-mechanical polishing (CMP) of semiconductor wafers to mirror finish required for fabrication. Critical for final surface preparation per statistical notes. Under HTS 8413.81.00 as other CMP liquid pumps.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include CMP slurry MSDS and pump wetted materials certification for classification
• Demonstrate removal rate and planarization specs tying to wafer fab standards
• Prevent reclassification by specifying 'CMP slurry recirculation pump' distinctly