Silicon Wafer Polishing Slurry Pump from China
Specialized pump circulating colloidal silica slurries for chemical-mechanical polishing (CMP) of semiconductor wafers to mirror finish required for fabrication. Critical for final surface preparation per statistical notes. Under HTS 8413.81.00 as other CMP liquid pumps.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include CMP slurry MSDS and pump wetted materials certification for classification
• Demonstrate removal rate and planarization specs tying to wafer fab standards
• Prevent reclassification by specifying 'CMP slurry recirculation pump' distinctly