Silicon Wafer Polishing Slurry Pump from Canada
Specialized pump circulating colloidal silica slurries for chemical-mechanical polishing (CMP) of semiconductor wafers to mirror finish required for fabrication. Critical for final surface preparation per statistical notes. Under HTS 8413.81.00 as other CMP liquid pumps.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Include CMP slurry MSDS and pump wetted materials certification for classification
• Demonstrate removal rate and planarization specs tying to wafer fab standards
• Prevent reclassification by specifying 'CMP slurry recirculation pump' distinctly