Semiconductor Wafer Lapping Fluid Pump from Japan
Precision metering pump for delivering lapping slurries and fluids in wafer preparation equipment to achieve critical flatness tolerances, per statistical note (b)(ii)(C). Used after slicing to prepare wafer surfaces for fabrication. Classifies under HTS 8413.81.00 as other liquid pumps for semiconductor processing.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Provide slurry composition analysis and flow rate specs proving semiconductor lapping application
• Include flatness tolerance data linking pump performance to wafer quality standards
• Document as 'wafer prep equipment pump' not generic to prevent duty reassessment