Semiconductor Wafer Lapping Fluid Pump from Germany
Precision metering pump for delivering lapping slurries and fluids in wafer preparation equipment to achieve critical flatness tolerances, per statistical note (b)(ii)(C). Used after slicing to prepare wafer surfaces for fabrication. Classifies under HTS 8413.81.00 as other liquid pumps for semiconductor processing.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide slurry composition analysis and flow rate specs proving semiconductor lapping application
• Include flatness tolerance data linking pump performance to wafer quality standards
• Document as 'wafer prep equipment pump' not generic to prevent duty reassessment