Semiconductor Wafer Lapping Fluid Pump from China
Precision metering pump for delivering lapping slurries and fluids in wafer preparation equipment to achieve critical flatness tolerances, per statistical note (b)(ii)(C). Used after slicing to prepare wafer surfaces for fabrication. Classifies under HTS 8413.81.00 as other liquid pumps for semiconductor processing.
Duty Rate — China → United States
35%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Provide slurry composition analysis and flow rate specs proving semiconductor lapping application
• Include flatness tolerance data linking pump performance to wafer quality standards
• Document as 'wafer prep equipment pump' not generic to prevent duty reassessment