8413.81.00/CMP Slurry Filtration Pump/Japan

CMP Slurry Filtration Pump from Japan

Pump recirculating filtered CMP slurry to maintain abrasive particle distribution for uniform wafer polishing rates across production. Semiconductor-specific filtration. HTS 8413.81.00.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Document filter micron ratings and particle size distribution control

• Link to specific CMP pad/conditioner systems used

CMP Slurry Filtration Pump from Japan — Import Duty Rate | HTS 8413.81.00