CMP Slurry Filtration Pump from Germany
Pump recirculating filtered CMP slurry to maintain abrasive particle distribution for uniform wafer polishing rates across production. Semiconductor-specific filtration. HTS 8413.81.00.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document filter micron ratings and particle size distribution control
• Link to specific CMP pad/conditioner systems used