8412.90.90.85/Wafer Slicing Diamond Saw/Mexico

Wafer Slicing Diamond Saw from Mexico

Wafer slicing diamond saws cut thin wafers from monocrystalline semiconductor boules, classified under HTS 8412.90.90.85 as motor parts for semiconductor wafer manufacturing equipment. They ensure precise slicing for subsequent device fabrication processes.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify diamond blade specs and wafer thickness capabilities in import docs

• Obtain BIS export licenses if sourcing from controlled countries

• Test for vibration-free operation certification to meet cleanroom standards

Wafer Slicing Diamond Saw from Mexico — Import Duty Rate | HTS 8412.90.90.85