Wafer Slicing Diamond Saw from Japan
Wafer slicing diamond saws cut thin wafers from monocrystalline semiconductor boules, classified under HTS 8412.90.90.85 as motor parts for semiconductor wafer manufacturing equipment. They ensure precise slicing for subsequent device fabrication processes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify diamond blade specs and wafer thickness capabilities in import docs
• Obtain BIS export licenses if sourcing from controlled countries
• Test for vibration-free operation certification to meet cleanroom standards