8412.90.90.85/Wafer Slicing Diamond Saw/Japan

Wafer Slicing Diamond Saw from Japan

Wafer slicing diamond saws cut thin wafers from monocrystalline semiconductor boules, classified under HTS 8412.90.90.85 as motor parts for semiconductor wafer manufacturing equipment. They ensure precise slicing for subsequent device fabrication processes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Specify diamond blade specs and wafer thickness capabilities in import docs

• Obtain BIS export licenses if sourcing from controlled countries

• Test for vibration-free operation certification to meet cleanroom standards